Series Resistance from Die to Package evaluator uses Series Resistance from Die to Package = Thermal Resistance between junction and Ambient-Series Resistance from Package to Air to evaluate the Series Resistance from Die to Package, The series resistance from die to package formula is defined as resistance experienced from die to package. Series Resistance from Die to Package is denoted by Θjp symbol.
How to evaluate Series Resistance from Die to Package using this online evaluator? To use this online evaluator for Series Resistance from Die to Package, enter Thermal Resistance between junction and Ambient (Θj) & Series Resistance from Package to Air (Θpa) and hit the calculate button.