Series Resistance from Die to Package Formula

Fx Copy
LaTeX Copy
Series Resistance from Die to Package is defined as the resistance experienced from die to the package. Check FAQs
Θjp=Θj-Θpa
Θjp - Series Resistance from Die to Package?Θj - Thermal Resistance between junction and Ambient?Θpa - Series Resistance from Package to Air?

Series Resistance from Die to Package Example

With values
With units
Only example

Here is how the Series Resistance from Die to Package equation looks like with Values.

Here is how the Series Resistance from Die to Package equation looks like with Units.

Here is how the Series Resistance from Die to Package equation looks like.

1.6Edit=3.01Edit-1.41Edit
You are here -
HomeIcon Home » Category Engineering » Category Electronics » Category CMOS Design and Applications » fx Series Resistance from Die to Package

Series Resistance from Die to Package Solution

Follow our step by step solution on how to calculate Series Resistance from Die to Package?

FIRST Step Consider the formula
Θjp=Θj-Θpa
Next Step Substitute values of Variables
Θjp=3.01K/mW-1.41K/mW
Next Step Convert Units
Θjp=3010K/W-1410K/W
Next Step Prepare to Evaluate
Θjp=3010-1410
Next Step Evaluate
Θjp=1600K/W
LAST Step Convert to Output's Unit
Θjp=1.6K/mW

Series Resistance from Die to Package Formula Elements

Variables
Series Resistance from Die to Package
Series Resistance from Die to Package is defined as the resistance experienced from die to the package.
Symbol: Θjp
Measurement: Thermal ResistanceUnit: K/mW
Note: Value should be greater than 0.
Thermal Resistance between junction and Ambient
Thermal Resistance between junction and Ambient is defined as the rise in the resistance due to the heating effect in junction.
Symbol: Θj
Measurement: Thermal ResistanceUnit: K/mW
Note: Value should be greater than 0.
Series Resistance from Package to Air
Series Resistance from Package to Air is defined as the resistance experienced from package to the air.
Symbol: Θpa
Measurement: Thermal ResistanceUnit: K/mW
Note: Value should be greater than 0.

Other formulas in CMOS Special Purpose Subsystem category

​Go Stage Effort
f=hg
​Go Fanout of Gate
h=fg
​Go Capacitance of External Load
Cout=hCin
​Go Gate Delay
Gd=2Nsr

How to Evaluate Series Resistance from Die to Package?

Series Resistance from Die to Package evaluator uses Series Resistance from Die to Package = Thermal Resistance between junction and Ambient-Series Resistance from Package to Air to evaluate the Series Resistance from Die to Package, The series resistance from die to package formula is defined as resistance experienced from die to package. Series Resistance from Die to Package is denoted by Θjp symbol.

How to evaluate Series Resistance from Die to Package using this online evaluator? To use this online evaluator for Series Resistance from Die to Package, enter Thermal Resistance between junction and Ambient j) & Series Resistance from Package to Air pa) and hit the calculate button.

FAQs on Series Resistance from Die to Package

What is the formula to find Series Resistance from Die to Package?
The formula of Series Resistance from Die to Package is expressed as Series Resistance from Die to Package = Thermal Resistance between junction and Ambient-Series Resistance from Package to Air. Here is an example- 0.0016 = 3010-1410.
How to calculate Series Resistance from Die to Package?
With Thermal Resistance between junction and Ambient j) & Series Resistance from Package to Air pa) we can find Series Resistance from Die to Package using the formula - Series Resistance from Die to Package = Thermal Resistance between junction and Ambient-Series Resistance from Package to Air.
Can the Series Resistance from Die to Package be negative?
No, the Series Resistance from Die to Package, measured in Thermal Resistance cannot be negative.
Which unit is used to measure Series Resistance from Die to Package?
Series Resistance from Die to Package is usually measured using the Kelvin per Milliwatt[K/mW] for Thermal Resistance. Kelvin per Watt[K/mW], Degree Fahrenheit hour per Btu (IT)[K/mW], Degree Fahrenheit Hour per Btu (th)[K/mW] are the few other units in which Series Resistance from Die to Package can be measured.
Copied!