Die Per Wafer evaluator uses Die Per Wafer = (pi*Wafer Diameter^2)/(4*Size of Each Die) to evaluate the Die Per Wafer, The Die Per Wafer formula is defined as the number of individual semiconductor chips (also known as dies) that can be fabricated on a single silicon wafer during the semiconductor manufacturing process. Die Per Wafer is denoted by DPW symbol.
How to evaluate Die Per Wafer using this online evaluator? To use this online evaluator for Die Per Wafer, enter Wafer Diameter (dw) & Size of Each Die (Sd) and hit the calculate button.