Series Resistance from Die to Package in CMOS Design and Applications Formulas

Series Resistance from Die to Package is defined as the resistance experienced from die to the package. And is denoted by Θ_jp. Series Resistance from Die to Package is usually measured using the Kelvin per Milliwatt for Thermal Resistance. Note that the value of Series Resistance from Die to Package is always positive.

Formulas to find Series Resistance from Die to Package in CMOS Design and Applications

fxSeries Resistance from Die to PackageGo

CMOS Design and Applications formulas that make use of Series Resistance from Die to Package

fxSeries Resistance from Package to AirGo

List of variables in CMOS Design and Applications formulas

fx Thermal Resistance between junction and Ambient Go

fx Series Resistance from Package to Air Go

FAQ

What is the Series Resistance from Die to Package?

Series Resistance from Die to Package is defined as the resistance experienced from die to the package. Series Resistance from Die to Package is usually measured using the Kelvin per Milliwatt for Thermal Resistance. Note that the value of Series Resistance from Die to Package is always positive.

Can the Series Resistance from Die to Package be negative?

No, the Series Resistance from Die to Package, measured in Thermal Resistance cannot be negative.

What unit is used to measure Series Resistance from Die to Package?

Series Resistance from Die to Package is usually measured using the Kelvin per Milliwatt[K/mW] for Thermal Resistance. Kelvin per Watt[K/mW], Degree Fahrenheit hour per Btu (IT)[K/mW], Degree Fahrenheit Hour per Btu (th)[K/mW] are the few other units in which Series Resistance from Die to Package can be measured.

Let Others Know

✖

Facebook

Twitter

Copied!